Academic Catalog

ME494 SPECIAL TOPICS IN MECHANICAL ENGINEERING: THERMAL ENGINEERING FOR MICRO ELECTRONIC SYSTEMS PACKAGING

Course Code: 5690494
METU Credit (Theoretical-Laboratory hours/week): 3(3-0)
ECTS Credit: 5.0
Department: Mechanical Engineering
Language of Instruction: English
Level of Study: Undergraduate
Course Coordinator: Assist.Prof.Dr FATMA NAZLI DNMEZER AKGN
Offered Semester: Fall Semesters.
Prerequisite: Set 1: 5690312
The course set above should be completed before taking ME494 SPECIAL TOPICS IN MECHANICAL ENGINEERING: THERMAL ENGINEERING FOR MICRO ELECTRONIC SYSTEMS PACKAGING .

Course Content

Thermal issues in microelectronic systems, packaging of devices, resistor network analysis, active and passive thermal management of devices, computational heat transfer, design and optimization of thermal management systems, thermal interface materials.