ME494 SPECIAL TOPICS IN MECHANICAL ENGINEERING: THERMAL ENGINEERING FOR MICRO ELECTRONIC SYSTEMS PACKAGING
| Course Code: |
5690494 |
| METU Credit (Theoretical-Laboratory hours/week): |
3(3-0) |
| ECTS Credit: |
5.0 |
| Department: |
Mechanical Engineering |
| Language of Instruction: |
English |
| Level of Study: |
Undergraduate |
| Course Coordinator: |
Assist.Prof.Dr FATMA NAZLI DÖNMEZER AKGÜN |
| Offered Semester: |
Fall Semesters. |
| Prerequisite: |
Set 1: 5690312
|
| The course set above should be completed before taking
ME494 SPECIAL TOPICS IN MECHANICAL ENGINEERING: THERMAL ENGINEERING FOR MICRO ELECTRONIC SYSTEMS PACKAGING . |
Course Content
Thermal issues in microelectronic systems, packaging of devices, resistor network analysis, active and passive thermal management of devices, computational heat transfer, design and optimization of thermal management systems, thermal interface materials.
